MOLD RELEASE FILM AND METHOD FOR PRODUCING MOLDED ARTICLE

WIPO Patent Application WO/2017/169654

A1

A mold release film (10) which has a multilayer structure wherein a first mold release layer (1) that is formed from a first thermoplastic resin material, a cushion layer (2) and a second mold release layer (3) that is formed from a second thermoplastic resin material are sequentially laminated in this order in the thickness direction. The cushion layer (2) has a thickness of from 10 μm to 200 μm (inclusive). If X is the total thickness of the mold release film (10) and Y is the thickness of the cushion layer (2), Y/X is more than 0.2 but less than 0.9. Both of the first thermoplastic resin material and the second thermoplastic resin material contain a thermoplastic resin and particles having an average particle diameter d50 of from 4 μm to 60 μm (inclusive). The content of the particles relative to the total weight of the first mold release layer (1) is from 0.5% by weight to 15% by weight (inclusive); and the content of the particles relative to the total weight of the second mold release layer (3) is from 0.5% by weight to 15% by weight (inclusive).

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YAMAMOTO SEIJI (JP)
FUJIMOTO TAKAHIRO (JP)

PCT/JP2017/009688

October 05, 2017

March 10, 2017

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SUMITOMO BAKELITE CO (JP)

B32B27/00; B29C33/68; B29C43/32; B32B27/18

JP2014221558A	2014-11-27
JP2013136208A	2013-07-11
JPH07199700A	1995-08-04
JPH09227241A	1997-09-02
JP2014151448A	2014-08-25
JP2003001772A	2003-01-08
JP2006175637A	2006-07-06
JP2004344962A	2004-12-09
JP2016092272A	2016-05-23

HAYAMI Shinji (JP)

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