Title:
MOLD RELEASE FILM AND METHOD FOR PRODUCING FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/173683
Kind Code:
A1
Abstract:
This mold release film comprises, on one surface, a first mold release layer that is formed from a thermoplastic resin material, while having a cushion layer on the first mold release layer. The cushion layer contains (B1) a polybutylene terephthalate (PBT), (B2) a polypropylene, and (B3) an ethylene-methyl methacrylate copolymer (EMMA).
Inventors:
YAMAMOTO SEIJI (JP)
Application Number:
PCT/JP2018/007859
Publication Date:
September 27, 2018
Filing Date:
March 01, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B27/00; B32B27/30; B32B27/32; B32B27/36; H05K3/28
Foreign References:
| JP2016144897A | 2016-08-12 | |||
| JP2016124270A | 2016-07-11 | |||
| JP2016068371A | 2016-05-09 | |||
| JP2015202662A | 2015-11-16 | |||
| JP2011062919A | 2011-03-31 | |||
| JP2008049504A | 2008-03-06 | |||
| JP2005280125A | 2005-10-13 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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