Title:
MOLD RELEASE FILM FOR THE RESIN ENCAPSULATION OF SEMICONDUCTORS
Document Type and Number:
WIPO Patent Application WO/2008/020543
Kind Code:
A1
Abstract:
The invention provides a mold release film for the resin encapsulation of semiconductors
which exhibits low gas permeability, little suffers from the staining of a mold
with an encapsulating resin, and exerts high mold release properties. The invention
relates to a gas-barrier mold release film for the resin encapsulation of semiconductors
which comprises a mold release layer (I) exerting excellent mold release properties
and a plastic base layer (II) supporting the layer (I), wherein the base layer
(II) exhibits a strength of 1 to 50MPa at 200% elongation and 170°C and the
mold release film exhibits a xylene gas permeability of 5Œ10-15
(kmol m/(s m2 kPa)) or below at 170°C. It is preferable that the
layer (I) be made of a fluororesin such as ethylene /tetrafluoroethylene copolymer,
while the layer (II) be made of an ethylene/vinyl alcohol copolymer.
Inventors:
OKUYA TAMAO (JP)
ARUGA HIROSHI (JP)
HIGUCHI YOSHIAKI (JP)
ARUGA HIROSHI (JP)
HIGUCHI YOSHIAKI (JP)
Application Number:
PCT/JP2007/064915
Publication Date:
February 21, 2008
Filing Date:
July 30, 2007
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
OKUYA TAMAO (JP)
ARUGA HIROSHI (JP)
HIGUCHI YOSHIAKI (JP)
OKUYA TAMAO (JP)
ARUGA HIROSHI (JP)
HIGUCHI YOSHIAKI (JP)
International Classes:
H01L21/56; B29C33/68
Foreign References:
| JP2002361643A | 2002-12-18 | |||
| JP2006049850A | 2006-02-16 | |||
| JP2004079566A | 2004-03-11 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (SIA Kanda Square 17, Kanda-konyacho, Chiyoda-k, Tokyo 35, JP)
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