Title:
MOLD RELEASE FILM WITH ANTISTATIC LAYER
Document Type and Number:
WIPO Patent Application WO/2024/018993
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an excellent mold release film for the production of a ceramic green sheet, the mold release film enabling the achievement of both reduction in electrostatic charge during unwinding and prevention of pinholes, local thickness variation and the like, even if a ceramic green sheet is thinned. The present invention provides a mold release film with an antistatic layer, the mold release film comprising a base material, an antistatic layer that is provided on one surface of the base material with a first functional layer being interposed therebetween, and a mold release layer that is provided on the other surface side of the base material. With respect to this mold release film with an antistatic layer, the antistatic layer is formed of an antistatic layer-forming composition that contains an antistatic agent and a thermosetting binder resin; the antistatic agent contains a conductive polymer; and the side on which the antistatic layer is provided has a surface resistivity (logΩ/□) of 3 to 10.
Inventors:
KUMEI RYOTA (JP)
AMANO YUKA (JP)
SHIBATA YUSUKE (JP)
NAKATANI MITSUHARU (JP)
AMANO YUKA (JP)
SHIBATA YUSUKE (JP)
NAKATANI MITSUHARU (JP)
Application Number:
PCT/JP2023/025924
Publication Date:
January 25, 2024
Filing Date:
July 13, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B27/18; B32B27/30; B32B27/42; H01G13/00
Domestic Patent References:
| WO2016133092A1 | 2016-08-25 |
Foreign References:
| JP2017218507A | 2017-12-14 |
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