Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2006/129533
Kind Code:
A1
Abstract:
A mold release film comprising a coating layer and a mold release layer provided in this order on one surface of a polyester film which is stretched at least in the monoaxial direction, the coating layer comprising an aluminum chelate compound and/or a zirconium chelate compound, the mold release film having a critical destruction load (CDC) on the mold release side of 40 mN or higher, and the quantity of an oligomer extracted with dimethylformamide from the surface of the mold release layer after treatment at 180&ring for 10 minutes being 1.5 mg/m2 or less. In the mold release film, the quantity of an oligomer precipitated therefrom is quite small and the adhesion of the mold release layer to a coating film is good.
Inventors:
ISAKI KIMIHIRO (JP)
Application Number:
PCT/JP2006/310316
Publication Date:
December 07, 2006
Filing Date:
May 24, 2006
Export Citation:
Assignee:
MITSUBISHI POLYESTER FILM CORP (JP)
ISAKI KIMIHIRO (JP)
ISAKI KIMIHIRO (JP)
International Classes:
B32B27/36; B32B27/00
Foreign References:
| JP2004177719A | 2004-06-24 | |||
| JP2004188814A | 2004-07-08 | |||
| JPH0345938U | 1991-04-26 | |||
| JP2005116925A | 2005-04-28 | |||
| JP2002088155A | 2002-03-27 |
Attorney, Agent or Firm:
Okada, Kazuhiko (6F Kudan Kangyou Bldg., 10-1, Kudan-kita
1-chome, Chiyoda-k, Tokyo 73, JP)
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