Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2016/133092
Kind Code:
A1
Abstract:
According to the present invention, a mold release film 10A comprises a substrate 11, an antistatic layer 12 provided on one side 11A of the substrate 11 and a mold release layer 13 provided on the antistatic layer 12 or on the other side of the substrate 11, wherein the one side 11A of the substrate 11 has an arithmetical mean roughness Ra of at most 15 nm and a maximum peak height Rp of at most 150 nm and the antistatic layer 12 is formed by curing an aqueous thermosetting resin composition that comprises a polythiophene conductive polymer (A) so that the thickness of the antistatic layer 12 is from 12-250 nm.
Inventors:
SATO KEIICHI (JP)
FUKAYA TOMOMI (JP)
FUKAYA TOMOMI (JP)
Application Number:
PCT/JP2016/054453
Publication Date:
August 25, 2016
Filing Date:
February 16, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B28B1/30; B32B27/18; C08J7/044
Foreign References:
| JP2012224011A | 2012-11-15 | |||
| JP2011201118A | 2011-10-13 | |||
| JP2015066908A | 2015-04-13 | |||
| JPH10229027A | 1998-08-25 | |||
| JP2006281572A | 2006-10-19 | |||
| JP2014189007A | 2014-10-06 | |||
| JP2003145685A | 2003-05-20 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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