Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2017/200056
Kind Code:
A1
Abstract:
Provided is a mold release film which exhibits excellent releasability from an adhesive, while being suppressed in migration, and which is suitable for the purpose of protecting various adhesive layers.
A mold release film which has, on at least one surface of a polyester film, a silicone-based mold release layer that is formed from a mold release agent composition containing a first polydimethyl siloxane which has a weight average molecular weight of from 500 to 30,000 (inclusive), while having at least one alkenyl group in each molecule, a second polydimethyl siloxane which has a weight average molecular weight of from 150 to 10,000 (inclusive), while having at least one hydrosilyl group in each molecule, and a platinum-based catalyst.
Inventors:
SUZUKI TARO (JP)
Application Number:
PCT/JP2017/018726
Publication Date:
November 23, 2017
Filing Date:
May 18, 2017
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B32B27/00; B32B27/36; C08J7/043; C08J7/044; C08J7/046; C08J7/06; C08L83/05; C08L83/07
Foreign References:
| JP2008214497A | 2008-09-18 | |||
| JP2007186804A | 2007-07-26 | |||
| JP2015208898A | 2015-11-24 | |||
| JP2007302775A | 2007-11-22 | |||
| JP2003292894A | 2003-10-15 | |||
| US20050118443A1 | 2005-06-02 |
Attorney, Agent or Firm:
OKADA, Kazuhiko (JP)
Download PDF:
Previous Patent: CELL CULTURE SUBSTRATUM, METHOD FOR PRODUCING CELL-CONTAINING MATERIAL, METHOD FOR PRODUCING CELL CU...
Next Patent: TRANSMISSION BELT
Next Patent: TRANSMISSION BELT