Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2019/044056
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a mold release film simultaneously satisfying the following: a defect inspection of a film to be transferred can be suitably performed; the mold release film can be easily identified; solvent resistance is good; and separability after heating is good. This mold release film for achieving the above purpose has the following configuration. Specifically, the mold release film has a mold release layer on at least one surface of a substrate film, wherein the haze value of the mold release film is 1.5% to 8.0%, and the mold release layer is a cured layer of an active energy ray curable composition including a compound that has an alkyl group containing 8 or more carbon atoms.
Inventors:
TSUJIUCHI NAOKI (JP)
NAKAGAKI TAKAMITSU (JP)
NAKAGAKI TAKAMITSU (JP)
Application Number:
PCT/JP2018/019260
Publication Date:
March 07, 2019
Filing Date:
May 18, 2018
Export Citation:
Assignee:
TORAY ADVANCED FILM CO LTD (JP)
International Classes:
B32B27/00; B32B7/02; B32B7/06
Foreign References:
| JP2014173065A | 2014-09-22 | |||
| JP2011230289A | 2011-11-17 | |||
| JP2001240775A | 2001-09-04 | |||
| JP2015199329A | 2015-11-12 | |||
| JP2016033173A | 2016-03-10 | |||
| JP2004197050A | 2004-07-15 |
Attorney, Agent or Firm:
ICHIJO, Chikara (JP)
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