Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2023/189634
Kind Code:
A1
Abstract:
[Problem] To provide a mold release film which has a light peeling force both before and after heating, which can have a light peeling force even when peeled at a high speed, and which substantially does not include silicone. [Solution] This mold release film has a base material film and a mold release layer. The mold release layer includes an acrylic resin (A), a crosslinking agent (B) and a mold release agent (C). The acrylic resin (A) includes an A-1 component represented by a chemical formula (formula 1) indicated in the specification and an A-2 component represented by (formula 2). The mold release film substantially does not include a silicone component. The mold release layer is a mold release film layered on the base material film. The ratio a/b of the mass (a) of the acrylic resin (A) and the mass (b) of the crosslinking agent (B) included in the mold release layer satisfies expression (I). The glass transition point of a resin making up the base material film is 100°C or greater. (I) 0.1≤a/b≤8.0
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Inventors:
ONO YUJI (JP)
NAKATANI MITSUHARU (JP)
NAKATANI MITSUHARU (JP)
Application Number:
PCT/JP2023/010205
Publication Date:
October 05, 2023
Filing Date:
March 15, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B27/30; C09D7/63; C09D133/06
Domestic Patent References:
| WO2020129962A1 | 2020-06-25 |
Foreign References:
| JP2018115224A | 2018-07-26 | |||
| JP2016190327A | 2016-11-10 | |||
| JP2021098845A | 2021-07-01 | |||
| JP2000159910A | 2000-06-13 | |||
| JP2001205763A | 2001-07-31 |
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