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Title:
MOLD RELEASE TREATMENT METHOD, MOLD, METHOD FOR PRODUCING ANTI-REFLECTIVE FILM, MOLD RELEASE TREATMENT DEVICE, AND WASHING/DRYING DEVICE FOR MOLD
Document Type and Number:
WIPO Patent Application WO/2011/111669
Kind Code:
A1
Abstract:
The disclosed mold release treatment method includes: a step for preparing a mold release agent containing a solvent and a fluorine compound having mold release properties, and for preparing a mold (100) having a porous alumina layer (14) on the surface thereof; a step for imparting to the surface of the mold a solvent that can dissolve the fluorine compound; and a step for thereafter imparting the mold release agent to the surface of the mold (100) by means of a spray coating method. Through the disclosed method, it is possible to carry out mold release treatment—without unevenness—of the surface of a mold having a porous alumina layer (14) on the surface thereof.

Inventors:
HAYASHI Hidekazu (())
林 秀和 (())
Application Number:
JP2011/055276
Publication Date:
September 15, 2011
Filing Date:
March 07, 2011
Export Citation:
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Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町22番22号 Osaka, 〒5458522, JP)
HAYASHI Hidekazu (())
International Classes:
B29C33/58; B29C33/38; B29C33/62; B29C33/72; B29C39/26
Attorney, Agent or Firm:
OKUDA Seiji (OKUDA & ASSOCIATES, 10th Floor Osaka Securities Exchange Bldg., 8-16, Kitahama 1-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
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