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Patent Searching and Data


Title:
MOLD RELEASING FILM FOR MANUFACTURING CERAMIC GREEN SHEET AND METHOD FOR MANUFACTURING MOLD RELEASING FILM
Document Type and Number:
WIPO Patent Application WO/2018/159247
Kind Code:
A1
Abstract:
[Problem] To provide a mold releasing film that contains at least a binder resin and a silicone-based resin as a mold releasing layer of the mold releasing film for manufacturing a ceramic green sheet, that has high smoothness achieved by suppression of a worsening of surface roughness due to coagulation of the above components during drying, and that has excellent releasability, and a method for manufacturing the mold releasing film. [Solution] A mold releasing film for manufacturing a ceramic green sheet comprises: a polyester film as a base material, the base material having a surface layer A not substantially containing particles on at least one side thereof; and a mold releasing layer having a film thickness of 0.2 μm or less laminated on a surface of the surface layer A on at least the one side directly or with the interposition of another layer, the mold releasing film characterized in that the mold releasing layer contains a binder component and a silicone-based mold releasing agent, and that a surface of the mold releasing layer has a maximum protrusion height (P) of 50 nm or less and an arithmetic average roughness (Sa) of 1.5 nm or less.

Inventors:
NAKATANI Mitsuharu (LTD. 1-1 Katata 2-chome, Otsu-sh, Shiga 92, 〒5200292, JP)
SHIBATA Yusuke (LTD. 1-1 Katata 2-chome, Otsu-sh, Shiga 92, 〒5200292, JP)
YAMAMOTO Yuichiro (LTD. 1-1 Katata 2-chome, Otsu-sh, Shiga 92, 〒5200292, JP)
MORI Kenichi (LTD. 2-8 Dojima Hama 2-chome, Kita-ku, Osaka-sh, Osaka 30, 〒5308230, JP)
SHIGENO Kento (LTD. 1-1 Katata 2-chome, Otsu-sh, Shiga 92, 〒5200292, JP)
MATSUO Yuka (LTD. 1-1 Katata 2-chome, Otsu-sh, Shiga 92, 〒5200292, JP)
Application Number:
JP2018/004342
Publication Date:
September 07, 2018
Filing Date:
February 08, 2018
Export Citation:
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Assignee:
TOYOBO CO., LTD. (2-8 Dojima Hama 2-chome, Kita-ku Osaka-sh, Osaka 30, 〒5308230, JP)
International Classes:
B28B1/30; B05D5/00; B05D7/00; B05D7/24; B32B27/00; B32B27/20; B32B27/36; C08J7/04; H01G4/12; H01G4/30; H01G13/00
Domestic Patent References:
WO2016133092A12016-08-25
Foreign References:
JP2010017932A2010-01-28
JP2014012417A2014-01-23
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