Title:
MOLD REPLACING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/057928
Kind Code:
A1
Abstract:
A mold replacing device (5) comprises: an upper guide (57) extending in the left-right direction along an upper mold holder (20); an upper mold replacing part that moves in the left-right direction while being guided by the upper guide (57), and places an upper mold (4) on the upper mold holder (20); a lower guide (58) extending in the left-right direction along a lower mold holder (18); and a lower mold replacing part that moves in the left-right direction while being guided by the lower guide (58), and places a lower mold (2) on the lower mold holder (18). During bending, the upper mold replacing part and the lower mold replacing part stand by at respective reference positions separated from each other in the left-right direction. The upper mold replacing part and the lower mold replacing part include, at sites facing each other when in the reference positions, retracting sections (555, 565) that each retract in a direction away from the counterpart thereof.
Inventors:
BANDEN KOHKI (JP)
Application Number:
PCT/JP2023/031444
Publication Date:
March 21, 2024
Filing Date:
August 30, 2023
Export Citation:
Assignee:
AMADA CO LTD (JP)
International Classes:
B21D37/04; B21D5/02
Domestic Patent References:
| WO2016063579A1 | 2016-04-28 | |||
| WO2020017540A1 | 2020-01-23 |
Foreign References:
| JP2019122972A | 2019-07-25 | |||
| JP2000071028A | 2000-03-07 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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