Title:
MOLD SURFACE TREATMENT METHOD AND MOLD TREATED WITH SAID METHOD
Document Type and Number:
WIPO Patent Application WO/2017/026056
Kind Code:
A1
Abstract:
Provided is a mold surface treatment method capable of achieving greatly improved releasability even when applied to a mold of any material. According to the present invention, a substantially spherical spray material is sprayed onto and impacted against the surface of a mold to form, in the surface, dimples each having a diameter W and a depth D which satisfy the conditions specified in the following equations: 1+3.3e-H/230≦ W ≦ 3+13.4e-H/1060···(Equation 1), and 0.01+0.2e-H/230≦ D ≦ 0.01+1.1e-H/500···(Equation 2), where W is the equivalent diameter (µm) of the dimples, D is the depth (µm) of the dimples, and H is the hardness (Hv) of the base material of the mold.
Inventors:
MASE KEIJI (JP)
ISHIBASHI SHOZO (JP)
KONDO YUSUKE (JP)
ISHIBASHI SHOZO (JP)
KONDO YUSUKE (JP)
Application Number:
PCT/JP2015/072793
Publication Date:
February 16, 2017
Filing Date:
August 11, 2015
Export Citation:
Assignee:
FUJI MFG CO LTD (JP)
International Classes:
B29C33/38; B22C9/06; B22D17/22
Foreign References:
| JP2012040744A | 2012-03-01 | |||
| JP2012183548A | 2012-09-27 |
Attorney, Agent or Firm:
OGURA, Masaaki (JP)
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