Title:
MOLD VARNISH, RESIN CURED MATERIAL, ELECTRIC POWER APPARATUS, AND VACUUM CIRCUIT BREAKER
Document Type and Number:
WIPO Patent Application WO/2017/104726
Kind Code:
A1
Abstract:
Provided is a mold varnish having excellent storage stability and low viscosity, a cured material thereof also having excellent toughness. The present invention uses a mold varnish comprising the three liquids of: a main agent A containing an epoxy resin which is liquid at normal temperature and has an epoxy equivalent of 200 g/eq or less, and a radical polymerization initiator; a curing agent B containing an acid anhydride which is liquid at normal temperature and an epoxy curing catalyst; and a reaction inducer C containing an acid anhydride which is liquid at normal temperature, an N-phenylmaleimide, and a styrene containing a polymerization inhibitor.
Inventors:
AMOU SATORU (JP)
ARAYA KOTARO (JP)
TAKEDA SHINTAROU (JP)
OOTAKE ATSUSHI (JP)
KOBAYASHI KINYA (JP)
MOTEKI RYOU (JP)
ARAYA KOTARO (JP)
TAKEDA SHINTAROU (JP)
OOTAKE ATSUSHI (JP)
KOBAYASHI KINYA (JP)
MOTEKI RYOU (JP)
Application Number:
PCT/JP2016/087322
Publication Date:
June 22, 2017
Filing Date:
December 15, 2016
Export Citation:
Assignee:
HITACHI INDUSTRY EQUIPMENT SYSTEMS CO LTD (JP)
International Classes:
C08G59/42; C08L63/00; H01B3/40
Domestic Patent References:
| WO2014061648A1 | 2014-04-24 |
Foreign References:
| JPH10114817A | 1998-05-06 | |||
| JPH06107770A | 1994-04-19 | |||
| JPS5316099A | 1978-02-14 | |||
| JPS6210133A | 1987-01-19 | |||
| JP2016121258A | 2016-07-07 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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