Title:
A MOLD
Document Type and Number:
WIPO Patent Application WO2002020236
Kind Code:
A3
Abstract:
A mold (1) is for molding a one-sided encapsulated electronic device. The mold (1) includes a first mold section (2) defining a mold cavity (4), and a second mold section (3) including a first recessed portion (6) adapted to receive a layer of material (15) attached to a leadframe (10), but not the leadframe (10).
Inventors:
VATH CHARLES JOSEPH (SG)
LIM LOON AIK (SG)
HO SHU CHUEN (SG)
HUI MAN HO (SG)
KOH JUAY SIM (SG)
KUAH TENG HOCK (SG)
LIM LOON AIK (SG)
HO SHU CHUEN (SG)
HUI MAN HO (SG)
KOH JUAY SIM (SG)
KUAH TENG HOCK (SG)
Application Number:
PCT/SG2000/000140
Publication Date:
May 23, 2002
Filing Date:
September 08, 2000
Export Citation:
Assignee:
ASM TECH SINGAPORE PTE LTD (SG)
VATH CHARLES JOSEPH (SG)
LIM LOON AIK (SG)
HO SHU CHUEN (SG)
HUI MAN HO (SG)
KOH JUAY SIM (SG)
KUAH TENG HOCK (SG)
VATH CHARLES JOSEPH (SG)
LIM LOON AIK (SG)
HO SHU CHUEN (SG)
HUI MAN HO (SG)
KOH JUAY SIM (SG)
KUAH TENG HOCK (SG)
International Classes:
B29C45/14; H01L21/56; (IPC1-7): H01L21/56; H01L21/00
Foreign References:
| US6081978A | 2000-07-04 | |||
| US6007317A | 1999-12-28 | |||
| EP0548496A1 | 1993-06-30 |
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