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Patent Searching and Data


Title:
MOLD
Document Type and Number:
WIPO Patent Application WO/2019/135465
Kind Code:
A1
Abstract:
Provided is a mold which is improved so as to enable the adjustment of the position of an insert pin for forming a hole in a molded article. The mold comprises: a core which forms a cavity corresponding to a molded article; a template which accommodates the core; and an insert pin which penetrates the template and the core in a first direction so as to form, inside the cavity, a hole in a molded article, and which is provided so as to be movable along the first direction.

Inventors:
KIM SANG BAEK (KR)
Application Number:
PCT/KR2018/010822
Publication Date:
July 11, 2019
Filing Date:
September 14, 2018
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
B22D17/24; B22D17/20
Domestic Patent References:
WO2010061437A12010-06-03
Foreign References:
KR20070004872A2007-01-09
KR20070002294A2007-01-05
KR20120043568A2012-05-04
KR20170071740A2017-06-26
Attorney, Agent or Firm:
SELIM INTELLECTUAL PROPERTY LAW FIRM (KR)
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