Title:
MOLD
Document Type and Number:
WIPO Patent Application WO/2020/012615
Kind Code:
A1
Abstract:
A mold (1) according to an embodiment of the present invention is formed by an additive manufacturing technique. The mold has: a heat medium flow path (10) which is provided inside the mold and through which a heat medium flows; a medium introduction port (4) through which the heat medium is introduced into the mold; a medium discharge port (5) through which the heat medium is discharged to the outside of the mold; and a buffering layer (20) positioned between the mold outer surface (1a) and the heat medium flow path. The buffering layer includes a low melting rate section (21), the melting rate of which is lower than a portion among the inside portions of the mold excluding the buffering layer.
Inventors:
SANO MASAHIRO (JP)
ITO RYODAI (JP)
SUZUKI AKIHIRO (JP)
TAKEDA SHIMPEI (JP)
YAMAMURA YASUMI (JP)
ITO RYODAI (JP)
SUZUKI AKIHIRO (JP)
TAKEDA SHIMPEI (JP)
YAMAMURA YASUMI (JP)
Application Number:
PCT/JP2018/026386
Publication Date:
January 16, 2020
Filing Date:
July 12, 2018
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
B22C9/24; B22C9/06; B22C9/28; B22F3/105; B22F3/16; B33Y80/00; F02F1/00; F02F7/00
Foreign References:
| JP2004142427A | 2004-05-20 | |||
| JP2010121187A | 2010-06-03 | |||
| JP2002322501A | 2002-11-08 | |||
| JPH04307207A | 1992-10-29 | |||
| EP1777479A2 | 2007-04-25 | |||
| US6145804A | 2000-11-14 |
Attorney, Agent or Firm:
OKUDA Seiji (JP)
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