MOLDABILITY MODIFIER FOR POLYPROPYLENE RESIN AND POLYPROPYLENE RESIN COMPOSITION CONTAINING THE SAME

Title:

MOLDABILITY MODIFIER FOR POLYPROPYLENE RESIN AND POLYPROPYLENE RESIN COMPOSITION CONTAINING THE SAME

Document Type and Number:

WIPO Patent Application WO/2002/038671

Kind Code:

A1

Abstract:

A polypropylene resin composition which has satisfactory moldability in injection molding, is excellent in flow mark properties during molding and in weld appearance, and is suitable for producing injection-molded articles such as exterior automotive parts; and a moldability modifier for use in the composition. The moldability modifier for polypropylene resins comprises at least one of a propylene homopolymer and a propylene random polymer which have a die swell ratio of from 1.5 to 2.5 and a ratio of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn), as measured by gel permeation chromatography (GPC) (Q value: Mw/Mn), of 7 to 13. The polypropylene resin composition is obtained by mixing the modifier with a propylene/ethylene block copolymer, an ethylene or styrene elastomer, an inorganic filler, etc.

Inventors:

ZANKA YUKIHITO (JP)
MURAYAMA MITSUHIRO (JP)
YAMAMOTO YOSHIHARU (JP)

Application Number:

PCT/JP2001/009789

Publication Date:

May 16, 2002

Filing Date:

November 08, 2001

Export Citation:

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Assignee:

JAPAN POLYCHEM CORP (JP)
ZANKA YUKIHITO (JP)
MURAYAMA MITSUHIRO (JP)
YAMAMOTO YOSHIHARU (JP)

International Classes:

C08F297/08; C08L23/10; C08L23/12; C08L53/00; C08F110/06; C08F210/06; C08L23/08; C08L23/14; (IPC1-7): C08L23/16; C08K3/34

Domestic Patent References:

WO1998054258A1

1998-12-03

Foreign References:

JPS60190409A	1985-09-27
JPH09169826A	1997-06-30
JPH11147923A	1999-06-02
JPH10251329A	1998-09-22

Other References: