Title:
MOLDED ASSEMBLY WITH HEATING ELEMENT CAPTURED THEREIN
Document Type and Number:
WIPO Patent Application WO2001078457
Kind Code:
A3
Abstract:
A heated element assembly and method of manufacturing a heated element assembly is provided. The heated element assembly includes a first and second molded sections [150, 160] shaped to mate with each other. A resistance heating element [100] is secured between the first and second molded sections [150, 160] by an interference fit. The resistance heating element [100] includes a piercable supporting substrate [105] and a resistance wire [110] sewn thereon. The resistance wire [110] is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded sections [150, 160]. The resistance heating element [100] is easily fixed in a position between the first and second molded sections [150, 160] and is capable of providing heat on vertical, horizontal and contoured surfaces.
Inventors:
VON ARX THEODORE
LAKEN KEITH
SCHLESSELMAN JOHN W
PAPENFUSS RONALD E
LAKEN KEITH
SCHLESSELMAN JOHN W
PAPENFUSS RONALD E
Application Number:
PCT/US2001/011235
Publication Date:
February 21, 2002
Filing Date:
April 06, 2001
Export Citation:
Assignee:
WATLOW POLYMER TECHNOLOGY (US)
International Classes:
A47G19/22; A47J27/00; A47J27/21; A47J36/24; H05B3/00; H05B3/18; H05B3/26; H05B3/28; (IPC1-7): H05B3/28; A47J27/00; H05B3/00; H05B3/26; B29C31/00
Foreign References:
US3806701A | 1974-04-23 | |||
US5271085A | 1993-12-14 | |||
FR2737380A1 | 1997-01-31 | |||
US6037574A | 2000-03-14 | |||
US2804533A | 1957-08-27 | |||
US3875373A | 1975-04-01 |
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