MOLDED BODY, METHOD FOR PRODUCING SAME, ELECTRONIC DEVICE MEMBER, AND ELECTRONIC DEVICE

WIPO Patent Application WO2010110305

A1

Disclosed is a molded body which is characterized by having a layer that is obtained by implanting ions of a hydrocarbon compound into a layer that contains a polyorganosiloxane compound. Also disclosed are: a method for producing the molded body, which comprises a step wherein ions of a hydrocarbon compound are implanted into the surface portion of a layer, which contains a polyorganosiloxane compound, in a molded body that has the layer containing a polyorganosiloxane compound in the surface; an electronic device member which is composed of the molded body; and an electronic device which is provided with the electronic device member. Consequently, the present invention provides: a molded body which has excellent gas barrier properties, transparency, bending properties, antistatic properties and surface smoothness; a method for producing the molded body; an electronic device member which is composed of the molded body; and an electronic device which is provided with the electronic device member.

HOSHI SHINICHI (JP)
KONDO TAKESHI (JP)
UEMURA KAZUE (JP)
SUZUKI YUTA (JP)

PCT/JP2010/055065

September 30, 2010

March 24, 2010

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LINTEC CORP (JP)
HOSHI SHINICHI (JP)
KONDO TAKESHI (JP)
UEMURA KAZUE (JP)
SUZUKI YUTA (JP)

B32B27/00; C08J7/00; C23C14/48

JP2001192826A	2001-07-17
JP2006070238A	2006-03-16
JP2005048252A	2005-02-24
JP2007283726A	2007-11-01
JP2006297737A	2006-11-02
JPH06344495A	1994-12-20
JP2007283726A	2007-11-01
JP2001026887A	2001-01-30
JP2001156013A	2001-06-08

See also references of EP 2412522A4

OHISHI HARUHITO (JP)
Haruhito Oishi (JP)

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