Title:
MOLDED BODY AND METHOD FOR PRODUCING MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2018/122963
Kind Code:
A1
Abstract:
This molded body has, as a main component, a polymer having a melting peak temperature of 180 to 260˚C. The dimensional change ratio of the molded body before and after a heat treatment in which the temperature of the molded body is maintained at 180˚C for 90 seconds, increased to 270˚C over 30 seconds, maintained at 270˚C for 30 seconds, and then decreased to 180˚C over 90 seconds is 1% or less. The mass change ratio of the molded body before and after being left standing for 2 weeks at 25˚C and a relative humidity of 40% is 1% or less.
Inventors:
YAMASAKI SATOSHI (JP)
NISHIKAWA SHINYA (JP)
OKABE SHOUHEI (JP)
KATAYAMA KOJI (JP)
NISHIKAWA SHINYA (JP)
OKABE SHOUHEI (JP)
KATAYAMA KOJI (JP)
Application Number:
PCT/JP2016/088901
Publication Date:
July 05, 2018
Filing Date:
December 27, 2016
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC FINE POLYMER INC (JP)
SUMITOMO ELECTRIC FINE POLYMER INC (JP)
International Classes:
B29C45/17
Foreign References:
| JP2015129243A | 2015-07-16 | |||
| JPH11181081A | 1999-07-06 | |||
| JPH0558021A | 1993-03-09 | |||
| JP2014105235A | 2014-06-09 |
Attorney, Agent or Firm:
NAKATA Motomi et al. (JP)
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