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Patent Searching and Data


Title:
MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/159865
Kind Code:
A1
Abstract:
Provided is a molded body which can reduce the adhesion of a biofilm. The molded body comprises: at least one resin (A) selected from the group consisting of a thermoplastic resin and a thermosetting resin; and an antibacterial/antifungal agent (B), wherein the solubility, in common logarithm logS, of the antibacterial/antifungal agent (B) in water at 25°C is less than -0.6, and the dispersion force component γd of the surface free energy is 25 mN/m or less, or the sum of dipole force component γp and hydrogen-bond component γh of the surface free energy is 30 mN/m or higher.

Inventors:
SAKURADA KENTA (JP)
NITTA EIJI (JP)
ICHIMIYA TAKAYA (JP)
KONISHI SHOTA (JP)
Application Number:
JP2019/004786
Publication Date:
August 22, 2019
Filing Date:
February 12, 2019
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L101/00; C08K5/00
Foreign References:
JP2007287683A2007-11-01
JPH1121378A1999-01-26
JP2002508800A2002-03-19
JP2015516382A2015-06-11
JP2012031329A2012-02-16
JP2011020945A2011-02-03
JP2011116919A2011-06-16
JP2014188940A2014-10-06
JP2013129951A2013-07-04
JP2017081842A2017-05-18
JPH06313017A1994-11-08
JP2013163885A2013-08-22
JPH11279350A1999-10-12
JPH1081855A1998-03-31
JPH08253690A1996-10-01
US20100240800A12010-09-23
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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