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Title:
MOLDED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/004704
Kind Code:
A1
Abstract:
Disclosed is a molded capacitor including a capacitor element coupling member, a cladding member that covers the capacitor element coupling member, and a support member embedded in the cladding member. The capacitor element coupling member contains a capacitor element having an electrode, and a bus bar that couples with the electrode of the capacitor element. The bus bar comprises a terminal portion. The cladding member covers the capacitor element coupling member in such a way that the terminal portion of the bus bar is exposed, and is constituted of a norbornene-based resin. The support member comprises a first end portion that abuts the capacitor element coupling member and a second end portion exposed through the cladding member, and is constituted of a thermally-conductive insulating material. The molded capacitor exhibits high heat resistance, is compact and lightweight, and can be inexpensively produced.

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Inventors:
TAKEOKA, Hiroki (())
竹岡宏樹 (())
KUBOTA, Hiroshi (())
久保田浩 (())
SHIMASAKI, Yukihiro (())
Application Number:
JP2009/003048
Publication Date:
January 14, 2010
Filing Date:
July 01, 2009
Export Citation:
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Assignee:
PANASONIC CORPORATION (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真1006番地 Osaka, 〒5718501, JP)
TAKEOKA, Hiroki (())
竹岡宏樹 (())
KUBOTA, Hiroshi (())
久保田浩 (())
International Classes:
H01G4/224; H01G2/08; H01G4/18; H01G4/228
Attorney, Agent or Firm:
NAITO, Hiroki et al. (1006 Oaza Kadoma, Kadoma-sh, Osaka 01, 〒5718501, JP)
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