Title:
MOLDED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/234052
Kind Code:
A1
Abstract:
This molded component comprises: an internal component which includes an electronic component body (detection element body) and lead wires extending from the electronic component body (detection element body); connection terminals that are connected to the lead wires 11, 13, 22, 23; a first molded portion which covers the internal component and holds the connection terminals; and a second molded portion that covers the first molded portion. The second molded portion includes a non-immersion region which is disposed in a region in which immersion is suppressed. A through-hole (outer through-hole) that reaches from the surface of the second molded portion to the first molded portion is only formed in the non-immersion region of the second molded portion.
Inventors:
WEI LIN (JP)
KOYANO HIROYUKI (JP)
TERASAKA YUKITOSHI (JP)
KOBAYASHI TOSHINARI (JP)
YAMAO MEGUMI (JP)
KOYANO HIROYUKI (JP)
TERASAKA YUKITOSHI (JP)
KOBAYASHI TOSHINARI (JP)
YAMAO MEGUMI (JP)
Application Number:
PCT/JP2023/018593
Publication Date:
December 07, 2023
Filing Date:
May 18, 2023
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
H01L23/04; G01P1/02
Foreign References:
| JP2004125767A | 2004-04-22 | |||
| JP2015126118A | 2015-07-06 | |||
| JP2014178248A | 2014-09-25 | |||
| JP2010071724A | 2010-04-02 | |||
| JP2003287025A | 2003-10-10 | |||
| JP2003251655A | 2003-09-09 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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