Title:
MOLDED ITEM CUTTING APPARATUS, METHOD OF CUTTING CERAMIC MOLDED ITEM, AND PROCESS FOR PRODUCING HONEYCOMB STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2007/116529
Kind Code:
A1
Abstract:
A molded item cutting apparatus that while preventing any after-cutting deformation
of cut surface, re-attachment of constituent material, etc., is capable of cutting
an extrusion molded item. There is provided a molded item cutting apparatus characterized
by including a first delivery member for delivering of an extrusion molded columnar
ceramic molded item; a cutting member capable of moving in not only the direction
parallel to the moving direction of the first delivery member but also the vertical
direction and, by passing through the interior of the ceramic molded item, cutting
the ceramic molded item into given lengths; and a second delivery member for delivering
of the ceramic molded item cut into given lengths by the cutting member, wherein
before the cutting of the ceramic molded item, the delivery speed of the first
delivery member is substantially identical with the moving speed in the parallel
direction of the cutting member, and wherein after the cutting of the ceramic
molded item, with respect to the delivery speed of the first delivery member,
the moving speed in the parallel direction of the cutting member and the delivery
speed of the second delivery member, the latter the greater.
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Inventors:
YAMAMURA NORIHIKO (JP)
NARUSE KAZUYA (FR)
SUMIYA EIJI (JP)
NARUSE KAZUYA (FR)
SUMIYA EIJI (JP)
Application Number:
PCT/JP2006/307645
Publication Date:
October 18, 2007
Filing Date:
April 11, 2006
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
YAMAMURA NORIHIKO (JP)
NARUSE KAZUYA (FR)
SUMIYA EIJI (JP)
YAMAMURA NORIHIKO (JP)
NARUSE KAZUYA (FR)
SUMIYA EIJI (JP)
International Classes:
B28B11/14; B26D1/60; B29C48/30
Foreign References:
JP2000296497A | 2000-10-24 | |||
JPH11216714A | 1999-08-10 | |||
JP2001096524A | 2001-04-10 |
Attorney, Agent or Firm:
YASUTOMI, Yasuo et al. (4-20 Nishinakajima 5-chome,Yodogawa-ku, Osaka-shi, Osaka 11, JP)
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