MOLDED OBJECT OF THERMOPLASTIC RESIN AND COMPOSITION

Title:

MOLDED OBJECT OF THERMOPLASTIC RESIN AND COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2001/083612

Kind Code:

A1

Abstract:

A molded object excellent in impact resistance, adhesion, and printability; and a heat-shrinkable film which is reduced in natural shrinkage, has a high shrinkage upon heating, has a low density and excellent solvent resistance, and is highly hygienic. The molded object comprises as major components (A) an ionomer which is a metal salt of a copolymer comprising $g(a)-olefin units and unsaturated carboxylic acid units and (B) a resin having an alicyclic structure in the molecule. A preferred embodiment of the molded object is made of a composition comprising the ionomer (A) and the resin (B). Another preferred embodiment is a layered product which comprises a layer comprising the ionomer (A) and superposed thereon a layer comprising the resin (B). Also provided is a composition which comprises the ionomer (A) and the resin(B) and from which the molded object can be produced.

Inventors:

HIROSE TOSHIYUKI (JP)
MAENO MASAO (JP)

Application Number:

PCT/JP2001/003709

Publication Date:

November 08, 2001

Filing Date:

April 27, 2001

Export Citation:

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Assignee:

MITSUI CHEMICALS INC (JP)
HIROSE TOSHIYUKI (JP)
MAENO MASAO (JP)

International Classes:

C08L23/08; C08L65/00; (IPC1-7): C08L23/26; C08J5/18

Domestic Patent References:

WO1996013530A1

1996-05-09

Foreign References:

JP2000159946A	2000-06-13
JP2000086778A	2000-03-28
JPH08267679A	1996-10-15
JPH08165357A	1996-06-25
JPS62257341A	1987-11-09

Other References: