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Title:
MOLDED PANEL HEAT TREATMENT METHOD AND HEAT TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/157310
Kind Code:
A1
Abstract:
A method for pressing a tool against a metal panel in which the perimeter thereof is held and moving the tool, thereby molding the metal panel into a molded panel P having a three-dimensional shape, and then heat-treating the molded panel P, wherein a heating body 1 to be heated by electromagnetic inductance is disposed on the surface of the molded panel P and then the heating body 1 is electromagnetic-induction-heated, whereby the molded panel P is electromagnetic-induction-heated via the heating body 1. Work is thereby facilitated, equipment cost is reduced, and productivity is enhanced.

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Inventors:
IWASE TAKAKUNI (JP)
MIWA HIROTAKA (JP)
Application Number:
PCT/JP2022/006995
Publication Date:
August 24, 2023
Filing Date:
February 21, 2022
Export Citation:
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Assignee:
NISSAN MOTOR (JP)
International Classes:
H05B6/10; B21D22/18
Foreign References:
JP2016215279A2016-12-22
JP2013118103A2013-06-13
JP2003236624A2003-08-26
Attorney, Agent or Firm:
MATOBA, Motonori (JP)
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