Title:
MOLDED RESIN, LAYERED OBJECT, AND PROCESSES FOR PRODUCING THESE
Document Type and Number:
WIPO Patent Application WO/2003/013844
Kind Code:
A1
Abstract:
A molded resin having improved adhesion. The molded resin (1) comprises a resin molding which has raised fibrils on at least part of the surface. The fibrils have a length of 50 µm or longer and a thickness of 10 µm or larger and are present on the molding surface in a number of 100 per cm2 or larger.
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Inventors:
MIYAMORI TSUYOSHI (JP)
SAKAMOTO YASUHIRO (JP)
UCHIDA TATSURO (JP)
ISHIWARI KAZUO (JP)
SAKAMOTO YASUHIRO (JP)
UCHIDA TATSURO (JP)
ISHIWARI KAZUO (JP)
Application Number:
PCT/JP2002/007877
Publication Date:
February 20, 2003
Filing Date:
August 01, 2002
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
MIYAMORI TSUYOSHI (JP)
SAKAMOTO YASUHIRO (JP)
UCHIDA TATSURO (JP)
ISHIWARI KAZUO (JP)
MIYAMORI TSUYOSHI (JP)
SAKAMOTO YASUHIRO (JP)
UCHIDA TATSURO (JP)
ISHIWARI KAZUO (JP)
International Classes:
B32B5/02; (IPC1-7): B32B5/02; B32B27/30
Foreign References:
| JPH10273543A | 1998-10-13 | |||
| JPS58162686A | 1983-09-27 | |||
| JPH08152033A | 1996-06-11 | |||
| JPH1112920A | 1999-01-19 | |||
| JPH06330473A | 1994-11-29 | |||
| JPH05186948A | 1993-07-27 | |||
| JPS62285839A | 1987-12-11 | |||
| JPH05279841A | 1993-10-26 |
Attorney, Agent or Firm:
Ono, Yukio (1-4-19 Minamimori-machi, Kita-k, Osaka-shi Osaka, JP)
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