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Patent Searching and Data


Title:
MOLDED SHEET CONTAINING POROUS METAL COMPLEX
Document Type and Number:
WIPO Patent Application WO/2022/220063
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a novel molded sheet in which PCP/MOF is fixed on a sheet substrate without being hydrolyzed. The present invention employs, for example, a molded sheet characterized by comprising a porous metal complex and a sheet substrate, and optionally an additive, wherein the porous metal complex is immobilized on the sheet substrate by a non-aqueous adhesive (e.g., polyvinyl acetal) and having an average particle diameter in the range of 0.2-50 μm.

Inventors:
IDE HIROKAZU (JP)
IMAI SACHIKO (JP)
WAKI KOUICHI (JP)
SONODA YUKIHIRO (JP)
FUJISAWA JUN (JP)
MAEDA KOUHEI (JP)
Application Number:
PCT/JP2022/014328
Publication Date:
October 20, 2022
Filing Date:
March 25, 2022
Export Citation:
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Assignee:
OHARA PARAGIUM CHEMICAL CO LTD (JP)
NIPPON GRAPHITE IND CO LTD (JP)
NIPPON GRAPHITE IND LTD (JP)
International Classes:
C09D201/00; A61L9/01; B01J20/26; B01J20/28; B01J20/30; C09D7/63
Foreign References:
JP2019088499A2019-06-13
JP2017100992A2017-06-08
JP2016516677A2016-06-09
JP2013111563A2013-06-10
JP6237059B22017-11-29
JP6629018B22020-01-15
JP2017224554A2017-12-21
JP2021062322A2021-04-22
Attorney, Agent or Firm:
SHIMIZU Naoto et al. (JP)
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