Title:
MOLDED THERMOPLASTIC ARTICLES COMPRISING THERMALLY CONDUCTIVE POLYMERS
Document Type and Number:
WIPO Patent Application WO/2012/088207
Kind Code:
A3
Abstract:
Disclosed are molded thermally conductive thermoplastic articles having low light reflectance, comprising thermoplastic polymers blended with thermally conductive fillers and carbon black powders. The polymer blends are characterized by a unique combination of high thermal conductiveness and low light reflectance. The molded articles in which such properties are desirable include, without limitation, a chassis structure for electrical and electronic devices wherein a light source is constructed inside and wherein heat is generated in the light source so as to be dissipated to an ambient atmosphere.
Inventors:
SAGA YUJI (JP)
Application Number:
PCT/US2011/066333
Publication Date:
September 20, 2012
Filing Date:
December 20, 2011
Export Citation:
Assignee:
DU PONT (US)
SAGA YUJI (JP)
SAGA YUJI (JP)
International Classes:
C08K3/00; C08K3/04
Foreign References:
| US20040251804A1 | 2004-12-16 |
Attorney, Agent or Firm:
HAMBY, William, H. (Legal Patent Records Center4417 Lancaster Pik, Wilmington Delaware, US)
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