Title:
MOLDING APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED THERETHROUGH
Document Type and Number:
WIPO Patent Application WO/2020/106053
Kind Code:
A1
Abstract:
Disclosed are a molding apparatus for manufacturing a semiconductor package and a semiconductor package manufactured therethrough. According to an embodiment of the present invention, since electromagnetic wave shielding efficiency of a semiconductor package may be increased by only a molding process without an additional process, a molding apparatus for manufacturing a semiconductor package and a semiconductor package manufactured therethrough may be provided, the molding apparatus being capable of simplifying a manufacturing process.
Inventors:
LEE IN HO (KR)
SEO YOUNG HO (KR)
KANG IL HO (KR)
PARK IL NAM (KR)
JEON BYUNG JIN (KR)
SEO YOUNG HO (KR)
KANG IL HO (KR)
PARK IL NAM (KR)
JEON BYUNG JIN (KR)
Application Number:
PCT/KR2019/015916
Publication Date:
May 28, 2020
Filing Date:
November 20, 2019
Export Citation:
Assignee:
ESMO INSTITUTE OF MATERIALS TECH (KR)
International Classes:
H01L23/31; H01L23/29; H01L23/552
Foreign References:
| KR20140081548A | 2014-07-01 | |||
| KR20170016026A | 2017-02-10 | |||
| KR20150052591A | 2015-05-14 | |||
| KR20180051932A | 2018-05-17 | |||
| JP2005079139A | 2005-03-24 |
Attorney, Agent or Firm:
KIM, Youn Gwon (KR)
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