Title:
MOLDING APPARATUS, MOLDING METHOD, AND METHOD FOR PRODUCING MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/040025
Kind Code:
A1
Abstract:
Provided is a molding technique that enables molding operation to be carried out smoothly and that is less likely to produce defective units. This molding apparatus is provided with: a nozzle part; a guide member for guiding a molding material to the nozzle part; and a heating device, the molding apparatus being further provided with a preventive mechanism that prevents melting of the molding material that is passing the guide member.
Inventors:
HIROOKA NOBUKI (JP)
YAMAWAKI MASAO (JP)
YAMAWAKI MASAO (JP)
Application Number:
PCT/JP2019/032005
Publication Date:
February 27, 2020
Filing Date:
August 15, 2019
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B29C64/30; B29C64/118; B29C64/35; B33Y10/00; B33Y30/00
Domestic Patent References:
| WO2017085961A1 | 2017-05-26 | |||
| WO2016167136A1 | 2016-10-20 |
Foreign References:
| JP2016518267A | 2016-06-23 | |||
| JP2018083872A | 2018-05-31 | |||
| JP2017128073A | 2017-07-27 | |||
| JP2016531020A | 2016-10-06 | |||
| CN106915075A | 2017-07-04 | |||
| CN206124226U | 2017-04-26 | |||
| JP2016078205A | 2016-05-16 | |||
| JP2016172317A | 2016-09-29 | |||
| JP4894982B1 | 2012-03-14 |
Other References:
See also references of EP 3842216A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
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