Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING APPARATUS, MOLDING METHOD, AND MOLDING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2017/199637
Kind Code:
A1
Abstract:
A molding apparatus is provided with a gate 29 for filling with a plasticizing material an injection molding space in which two intermediate substrates 6 and 7 are set, one of the intermediate substrates having a hole part 6h formed therein. The molding apparatus is provided with: a holder unit 32 capable of positioning the two intermediate substrates in the injection molding space while making the same face each other; and a supporting mechanism 33 having a pressing surface 33s that presses the two intermediate substrates positioned in the injection molding space toward the periphery of the gate to cause the hole part to be situated next to the gate. The plasticizing material filled from the gate is formed as an intermediate layer between the two intermediate substrates after passing through the hole part.

Inventors:
ASANUMA NOBUYUKI (JP)
Application Number:
PCT/JP2017/014587
Publication Date:
November 23, 2017
Filing Date:
April 07, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOSHIBA MACHINE CO LTD (JP)
International Classes:
B29C45/14; B29C45/26
Foreign References:
JP2009274412A2009-11-26
JP2016203419A2016-12-08
Attorney, Agent or Firm:
S & S INTERNATIONAL PPC (JP)
Download PDF: