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Patent Searching and Data


Title:
MOLDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/010266
Kind Code:
A1
Abstract:
Provided is a molding apparatus which makes it easy to produce a molded article and which enables use of a mold, not adaptable to electric conduction, as it is. The molding apparatus 100 is provided with a first mold 110 and a second mold 130. The first mold 110 is attached to a first conductor plate 120 with an insulator 114 therebetween so as to be freely detached/reattached by means of a first mold attachment tool 115. Further, the second mold 130 is attached to a second conductor plate 140 with an insulator 134 therebetween so as to be freely detached/reattached by means of a second mold attachment tool 135. The first mold attachment tool 115 and the second mold attachment tool 135 are provided on the first conductor plate 110 and the second conductor plate 140, respectively. The first conductor plate 110 and the second conductor plate 140 are attached to a first platen 123 and a second platen 143, respectively, with insulators 122 and 142 therebetween, respectively. Further, the molding apparatus 100 is provided with a power supply device 153 which causes a high-frequency current to flow in the first conductor plate 110 and the second conductor plate 140.

Inventors:
TAKAI MITSUO (JP)
Application Number:
JP2016/068844
Publication Date:
January 19, 2017
Filing Date:
June 24, 2016
Export Citation:
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Assignee:
CAP CO LTD (JP)
International Classes:
B22C9/06; B21D22/20; B21D24/00; B21D37/16; B22D17/22; B22D18/04; B29C33/08
Foreign References:
JPH1034655A1998-02-10
JPH02148744U1990-12-18
JPS5739222U1982-03-02
Attorney, Agent or Firm:
ITO HIROYUKI (JP)
居藤 Hiroyuki (JP)
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