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Patent Searching and Data


Title:
MOLDING FOR AUTOMOBILE
Document Type and Number:
WIPO Patent Application WO/2004/060992
Kind Code:
A1
Abstract:
A molding for an automobile, which comprises a portion formed from an elastomeric material comprising an olefin based random copolymer produced by copolymerizing ethylene, an &agr -olefin having 3 to 10 carbon atoms and an unsaturated monomer having a functional group, and optionally a non-conjugated diene and a metal ion for cross-linking the olefin based random copolymer. The molding for an automobile is excellent in the resistance to marring, exhibits high gloss, and also is excellent in weatherability.

Inventors:
KANAE KENTAROU (JP)
HAYAKAWA TOSHIYUKI (JP)
TANAKA MINORU (JP)
MORIKAWA AKIHIKO (JP)
Application Number:
PCT/JP2003/016631
Publication Date:
July 22, 2004
Filing Date:
December 24, 2003
Export Citation:
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Assignee:
JSR CORP (JP)
KANAE KENTAROU (JP)
HAYAKAWA TOSHIYUKI (JP)
TANAKA MINORU (JP)
MORIKAWA AKIHIKO (JP)
International Classes:
C08F8/44; C08F232/00; B60R13/04; C08L23/08; C08L23/16; C08L101/00; C08L23/04; C08L23/10; (IPC1-7): C08L23/08; B60R13/04
Foreign References:
EP1180534A12002-02-20
JP2002020563A2002-01-23
JPH05279489A1993-10-26
JPH051186A1993-01-08
JPH05320447A1993-12-03
JPH069838A1994-01-18
JP2000191864A2000-07-11
JP2000302928A2000-10-31
Other References:
See also references of EP 1577343A4
Attorney, Agent or Firm:
Ohi, Masahiko (6-1 Kanda Ogawa-machi 3-chom, Chiyoda-ku Tokyo, JP)
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