Title:
MOLDING COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2017/079924
Kind Code:
A1
Abstract:
Examples of techniques for molding molded components are described herein. In an example, amolding apparatus for molding a molded component includes a first mold-half comprising a mold-facing surface, and a slider member mounted on the first mold-half and movable substantially along the mold-facing surface. The first mold-half and the slider member can form a part of a mold cavity therebetween. Further, the molding apparatus includes a second mold-half to cooperate with the first mold-half to complete the mold cavity with the first mold-half and the slider member. The slider member is movable to modify a draft angle provided in the mold cavity.
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Inventors:
YEN WEI-FENG WEBER (CN)
YU QIU FENG (CN)
CHIU CHIENCHIH HENRY (CN)
CHEN BIN (CN)
YU QIU FENG (CN)
CHIU CHIENCHIH HENRY (CN)
CHEN BIN (CN)
Application Number:
PCT/CN2015/094309
Publication Date:
May 18, 2017
Filing Date:
November 11, 2015
Export Citation:
Assignee:
HEWLETT PACKARD DEVELOPMENT CO LP (US)
YEN WEI-FENG WEBER (CN)
YU QIU FENG (CN)
CHIU CHIENCHIH HENRY (CN)
CHEN BIN (CN)
YEN WEI-FENG WEBER (CN)
YU QIU FENG (CN)
CHIU CHIENCHIH HENRY (CN)
CHEN BIN (CN)
International Classes:
B29C45/00
Foreign References:
| CN101909845A | 2010-12-08 | |||
| CN201685405U | 2010-12-29 | |||
| US20050232803A1 | 2005-10-20 |
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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