Title:
MOLDING COMPOSITION MANUFACTURING METHOD, MOLDED BODY MANUFACTURING METHOD, MOLDING MATERIAL, AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/153498
Kind Code:
A1
Abstract:
According to an embodiment, the present invention provides a molding composition manufacturing method including: a step for obtaining a raw material composition containing inorganic solid materials and an organic material that is liquidized by being heated, to glue the inorganic solid materials together; a step for heating the raw material composition in a material space; and a step for extruding the heated raw material composition, as a molding composition, from the material space.
Inventors:
SAKAI YUYA (JP)
KIKUCHI YUTA (JP)
TANAKA RIKU (JP)
KIKUCHI YUTA (JP)
TANAKA RIKU (JP)
Application Number:
PCT/JP2023/004585
Publication Date:
August 17, 2023
Filing Date:
February 10, 2023
Export Citation:
Assignee:
UNIV TOKYO (JP)
International Classes:
B28B3/20
Foreign References:
| JP2002020148A | 2002-01-23 | |||
| JP2006007138A | 2006-01-12 | |||
| JP2000128663A | 2000-05-09 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
Download PDF: