Title:
MOLDING COMPOSITIONS CONTAINING QUATERNARY ORGANOPHOSPHONIUM SALTS
Document Type and Number:
WIPO Patent Application WO2004074366
Kind Code:
A3
Abstract:
Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. The molding compositions may further include a flame retardant compound such as melamine cyanurate. In a further embodiment, the molding composition may include an additional catalyst, such as 1,8-diazabicyclo[5.4.0]undec-7-ene. Integrated circuits encapsulated with such molding compositions exhibit reduced electrothermally induced parasitic gate leakage.
Inventors:
GALLO ANTHONY A (US)
DIMKE MARK T (US)
AHSAN TANWEER (US)
DIMKE MARK T (US)
AHSAN TANWEER (US)
Application Number:
PCT/US2004/005029
Publication Date:
December 29, 2004
Filing Date:
February 20, 2004
Export Citation:
Assignee:
HENKEL CORP (US)
GALLO ANTHONY A (US)
DIMKE MARK T (US)
AHSAN TANWEER (US)
GALLO ANTHONY A (US)
DIMKE MARK T (US)
AHSAN TANWEER (US)
International Classes:
C08G59/32; C08G59/68; C08K5/50; H01L23/29; C08K5/3492; (IPC1-7): C08L63/00; C08G65/10; B32B27/38; H01L29/12
Foreign References:
| US6255365B1 | 2001-07-03 |
Other References:
FLICK E.W.: "Plastic additives", September 2001, pages: 243, XP008066613
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