Title:
MOLDING DEVICE AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/014987
Kind Code:
A1
Abstract:
A molding device aligns a fixed-side mold (10) and a movable-side mold (20) by mating protruding blocks (15) and recessed blocks (25), and thus has excellent alignment repetition accuracy, and is capable of effectively minimizing the eccentricity between lens forming surfaces of both molds (10, 20). In addition, since the mating position can be shifted in the direction in which the protruding blocks (15) and the recessed blocks (25) cross at right angles in the direction of closing, by aligning the direction in which the molds (10, 20) thermally expand and the direction in which shifting is permitted, misalignments due to the occurrence of temperature differences in the molds (10, 20), in other words, misalignments due to thermal expansion differences can be minimized without placing a load on the molds.
Inventors:
TAGAWA, Tomohiko (INC. 2970, Ishikawa-machi, Hachioji-sh, Tokyo 05, 〒1928505, JP)
Application Number:
JP2011/067294
Publication Date:
February 02, 2012
Filing Date:
July 28, 2011
Export Citation:
Assignee:
KONICA MINOLTA OPTO, INC. (2970, Ishikawa-machi Hachioji-sh, Tokyo 05, 〒1928505, JP)
コニカミノルタオプト株式会社 (〒05 東京都八王子市石川町２９７０番地 Tokyo, 〒1928505, JP)
コニカミノルタオプト株式会社 (〒05 東京都八王子市石川町２９７０番地 Tokyo, 〒1928505, JP)
International Classes:
B29C33/30; B29C45/36; B29L11/00
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (Nikko Kagurazaka Bldg, 18 Iwatocho, Shinjuku-k, Tokyo 32, 〒1620832, JP)
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Claims: