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Patent Searching and Data


Title:
MOLDING DEVICE AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/002926
Kind Code:
A1
Abstract:
[Problem] According to the present invention, it is possible to more appropriately flatten an ink layer during molding of a three-dimensional object, for example. [Solution] Provided is a molding device for molding a three-dimensional object by a laminate molding method, the molding device being provided with: an inkjet head; a flattening means; a molding base; a main scanning drive unit; and a laminating direction drive unit for changing the distance between head bases, which is the distance between the ink jet head and the molding base. In an operation for forming a one ink layer, a main scanning operation in which the inkjet head is moved in one direction is performed several times on the same position of the three-dimensional object being molded. Regarding the distance between the head bases, in the operation for forming the one ink layer, the distance between the head bases during the main scanning operation performed later is made larger than the distance between the head bases during the main scanning operation performed earlier.

Inventors:
HAKKAKU Kunio (2182-3, Shigeno-Otsu, Tomi-cit, Nagano 12, 〒3890512, JP)
OCHI Kazuhiro (2182-3, Shigeno-Otsu, Tomi-cit, Nagano 12, 〒3890512, JP)
EGUCHI Terusumi (2182-3, Shigeno-Otsu, Tomi-cit, Nagano 12, 〒3890512, JP)
Application Number:
JP2016/069466
Publication Date:
January 05, 2017
Filing Date:
June 30, 2016
Export Citation:
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Assignee:
MIMAKI ENGINEERING CO.,LTD. (2182-3, Shigeno-Otsu Tomi-cit, Nagano 12, 〒3890512, JP)
International Classes:
B29C67/00; B33Y10/00; B33Y30/00
Domestic Patent References:
2014-05-08
Foreign References:
JP2015000476A2015-01-05
JP2008538329A2008-10-23
JP2013067121A2013-04-18
JP2013067119A2013-04-18
JP2013067118A2013-04-18
Attorney, Agent or Firm:
TAKEHARA Naohiko (KIOIZAKA THEMIS LAW OFFICES, 5th floor KIOICHO PARK BLDG. 3-6, Kioich, Chiyoda-ku Tokyo 94, 〒1020094, JP)
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