Title:
MOLDING DEVICE AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/150110
Kind Code:
A1
Abstract:
Provided are a molding device and molding method that can suppress variations in quenching properties of metal pipe. When, in a state wherein an upper mold 12 and a lower mold 11 are aligned with each other, a control unit 70 supplies a gas to the inside of metal pipe material 14 from a gas supply unit 60 so as to mold the metal pipe material 14 within the main cavity into a pipe part, the control unit controls the gas supply unit to supply the gas such that a first pressure is maintained for the pressure inside the metal pipe material 14. Thus, it is possible to prevent reductions in pressure within the pipe part that accompany cooling of the pipe part caused by contact of the pipe part with the upper mold 12 and lower mold 11. By preventing the lowering of pressure within the pipe part, reductions in the force pressing the pipe part to the upper mold 12 and the lower mold 11 can be suppressed. Therefore, it is possible to suppress reductions in the adherence of the pipe part with the upper mold 12 and the lower mold 11 during metal pipe molding and suppress occurrences of variations in quenching properties in the pipe part of the metal pipe.
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Inventors:
ISHIZUKA MASAYUKI (JP)
NOGIWA KIMIHIRO (JP)
UENO NORIEDA (JP)
SAIKA MASAYUKI (JP)
NOGIWA KIMIHIRO (JP)
UENO NORIEDA (JP)
SAIKA MASAYUKI (JP)
Application Number:
PCT/JP2017/004546
Publication Date:
September 08, 2017
Filing Date:
February 08, 2017
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D26/041
Foreign References:
| JP2012000654A | 2012-01-05 | |||
| JP2001259754A | 2001-09-25 | |||
| JP2015505275A | 2015-02-19 |
Other References:
See also references of EP 3424607A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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