Title:
MOLDING DEVICE, MOLDED PRODUCT, MIRROR UNIT, AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/010197
Kind Code:
A1
Abstract:
Provided are a molding device which is capable of large-scale production and yet can manufacture a mirror unit having good precision, a molded product, a mirror unit, and a molding method. In the present invention, after a resin is solidified, when a movable die MD is separated with respect to a fixed die, an angular pin AP pushes a holder SDc of a slide die SD outward while retreating from an opening BSa, and therefore moves in an X direction and Y direction in which the slide die SD separates from the fixed die FD. The slide die SD stops at the time the angular pin AP comes out of a cylindrical hole SDd, but exceeds a distance L corresponding to an undercut part of a molded product MP in this state, and the slide die SD has moved a distance sufficient to extract the molded product, and the molded product can therefore be extracted.
Inventors:
MORI HAJIME (JP)
HARA SHINICHIRO (JP)
SAWANOBORI DAISUKE (JP)
IDE YOSHINORI (JP)
HARA SHINICHIRO (JP)
SAWANOBORI DAISUKE (JP)
IDE YOSHINORI (JP)
Application Number:
PCT/JP2016/067008
Publication Date:
January 19, 2017
Filing Date:
June 08, 2016
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B29C45/33; B29L11/00; G01S7/481; G02B26/12
Domestic Patent References:
| WO2014168137A1 | 2014-10-16 |
Foreign References:
| JPH03130715A | 1991-06-04 | |||
| JP2007237665A | 2007-09-20 | |||
| JPH06331918A | 1994-12-02 | |||
| JP2001341165A | 2001-12-11 |
Attorney, Agent or Firm:
TAMURA Keijiro et al. (JP)
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