Title:
MOLDING DEVICE AND PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2016/204144
Kind Code:
A1
Abstract:
Provided is a molding device capable of reducing waviness and bends in fiber bundles. The molding device is provided with: a fiber supply device for supplying fiber bundles; a resin supply device for supplying resin; a curing acceleration device for accelerating the curing of the supplied resin with tension acting on the supplied fiber bundles; and a moving device for relatively moving the supply position of the fiber bundles, the supply position of the resin, and the curing acceleration position.
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Inventors:
SUKEMUNE TAKESHI (JP)
OKUBO AKINORI (JP)
ARAGANE YOSUKE (JP)
KIMURA GAKU (木村 學)
OKUBO AKINORI (JP)
ARAGANE YOSUKE (JP)
KIMURA GAKU (木村 學)
Application Number:
PCT/JP2016/067667
Publication Date:
December 22, 2016
Filing Date:
June 14, 2016
Export Citation:
Assignee:
GH CRAFT LTD (JP)
International Classes:
B29C70/06; B29K105/08
Domestic Patent References:
WO2011078336A1 | 2011-06-30 | |||
WO2016047141A1 | 2016-03-31 |
Foreign References:
JP2013006415A | 2013-01-10 | |||
JP2010173100A | 2010-08-12 | |||
JPH1134073A | 1999-02-09 | |||
JP2015160433A | 2015-09-07 |
Other References:
See also references of EP 3311991A4
Attorney, Agent or Firm:
HARADA Junji et al. (JP)
Junji Harada (JP)
Junji Harada (JP)
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