MOLDING DEVICE - SUMITOMO HEAVY INDUSTRIES

Title:

MOLDING DEVICE

Document Type and Number:

WIPO Patent Application WO/2016/158778

Kind Code:

A1

Abstract:

The present invention provides a molding device which can be made more compact. A molding device 10 for molding a metal pipe by heating and expanding a metal pipe material 14 between an upper mold 12 and a lower mold 11 which constitute a metal mold pair, the molding device 10 being equipped with: upper electrodes 17, 18 and lower electrodes 17, 18 that heat the metal pipe material 14 and sandwich both end sections of the metal pipe material 14 in the vertical direction; and a bus-bar 52 that supplies power from a power source 51 and is connected to the lower electrodes 17, 18. Thus, the bus-bar 52 that was connected to the upper electrodes 17, 18 is unnecessary, the region occupied by the bus-bar overall is smaller, and as a result, the molding device 10 is more compact.

Inventors:

SAIKA MASAYUKI (JP)
ISHIZUKA MASAYUKI (JP)
UENO NORIEDA (JP)

Application Number:

PCT/JP2016/059683

Publication Date:

October 06, 2016

Filing Date:

March 25, 2016

Export Citation:

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Assignee:

SUMITOMO HEAVY INDUSTRIES (JP)

International Classes:

B21D26/047; B21D26/033; B21D37/16

Domestic Patent References:

WO2014061473A1

2014-04-24

Foreign References:

JP2012000654A	2012-01-05
US20070101786A1	2007-05-10

Other References: