Title:
MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/158787
Kind Code:
A1
Abstract:
A molding device 10 equipped with: a blowing mechanism 60 for supplying a gas to a metal pipe material 14 and causing the expansion thereof; a slide 82 and a metal mold attachment base 84 that contact the expanded metal pipe material 14, and have a blow-molding mold 13 for molding a metal pipe 80 attached thereto; an exhaust mechanism 90 for discharging the gas from the metal pipe material 14; and a supply-side pressure sensor 91 and a discharge-side pressure sensor 92 for detecting the pressure of the gas. In addition, the blowing mechanism 60 is equipped with a gas-compression unit 61 for compressing the gas, and a molding supply line L2 for delivering the gas compressed by the gas compression unit 61 to the metal pipe material 14. Furthermore, the exhaust mechanism 90 is equipped with a discharge line L3 for transporting the discharged gas, the supply-side pressure sensor 91 is provided in the molding supply line L2, and the discharge-side pressure sensor 92 is provided in the discharge line L3.
Inventors:
SAIKA MASAYUKI (JP)
ISHIZUKA MASAYUKI (JP)
UENO NORIEDA (JP)
ISHIZUKA MASAYUKI (JP)
UENO NORIEDA (JP)
Application Number:
PCT/JP2016/059704
Publication Date:
October 06, 2016
Filing Date:
March 25, 2016
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D26/041
Foreign References:
| JP2009220141A | 2009-10-01 | |||
| JPS5015775A | 1975-02-19 | |||
| JPS62264870A | 1987-11-17 | |||
| JPS51129860A | 1976-11-11 | |||
| JP2005000943A | 2005-01-06 | |||
| JP2012000654A | 2012-01-05 | |||
| JP2003154415A | 2003-05-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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