Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/225550
Kind Code:
A1
Abstract:
A molding device comprises an insert mold and a matrix to which the insert mold is replaceably attached. The matrix includes a pipe through which a temperature adjustment fluid flows. Between the insert mold and the matrix, an elastically deformable heat transmission member that contacts both the insert mold and the matrix during at least molding is arranged. Thus, a molding device that is capable of effectively adjusting, while using a matrix to which an insert mold is replaceably attached, a temperature of the insert mold without increasing a mold manufacturing cost or time and effort for replacement can be provided.

More Like This:
JPH02127002INJECTION MOLDING APPARATUS OF CERAMIC
JPS54148134DIE CASTING AND APPARATUS THEREFOR
JPH05293864TEMPERATURE MEASURING METHOD FOR MOLDING DIE FOR INJECTION MOLDING, TEMPERATURE MEASURING STRUCTURE OF ITS MOLD AND ROTARY MOLDING SYSTEM PROVIDED WITH SAME MOLD
Inventors:
MIZUKANE TAKAHIRO (JP)
Application Number:
PCT/JP2018/020279
Publication Date:
December 13, 2018
Filing Date:
May 28, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B29C45/26; B29C33/04
Domestic Patent References:
WO2004107335A12004-12-09
Foreign References:
JP2009073114A2009-04-09
JPH056539A1993-01-14
JP2013154625A2013-08-15
JPH09314571A1997-12-09
JPH06285915A1994-10-11
JPH10119091A1998-05-12
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: FLUORINE-CONTAINING MONOMER, FLUORINE-CONTAINING POLYMER, PATTERN FORMING COMPOSITION USING SAME, AN...

Next Patent: INKJET HEAD AND INKJET RECORDING DEVICE