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Patent Searching and Data


Title:
MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/187383
Kind Code:
A1
Abstract:
This molding device (molding device 10) is for swelling a metal pipe material (metal pipe material 14) and molding a metal pipe, the molding device being provided with: a mold (mold 13) where the metal pipe is molded with an upper mold (upper mold 12) and a lower mold (lower mold 11); a lower base section (lower base section 110) provided to the lower side of the lower mold; an upper base section (upper base section 120) provided to the upper side of the upper mold; a column (column 150) erected between the lower base section and the upper base section; and an electric heating unit (electric heating unit 50) for heating electrically by supplying power to the metal pipe material that is arranged between the upper mold and the lower mold. The column has an internal magnetic flux density that, during electric heating by the electric heating unit, is higher than a magnetic flux density at the center of a lower surface of the lower base section and/or a magnetic flux density at the center of an upper surface of the upper base section.

Inventors:
SAIKA MASAYUKI (JP)
KAN HIROYUKI (JP)
YAMAUCHI KEI (JP)
Application Number:
PCT/JP2018/045925
Publication Date:
October 03, 2019
Filing Date:
December 13, 2018
Export Citation:
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Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D26/033; B21D37/16
Domestic Patent References:
WO2017038692A12017-03-09
WO2017038692A12017-03-09
Foreign References:
JP2002096118A2002-04-02
JP2015112608A2015-06-22
Other References:
See also references of EP 3778058A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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