Title:
MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/001878
Kind Code:
A1
Abstract:
This molding device (100) is provided with: a material supply device (18) that supplies a molding material (BM) onto a support surface (SS); a beam irradiating unit (16) that irradiates the molding material on the support surface (SS) with an energy beam (EB); a table device (12) that supports a support surface member (MP) which has the support surface; a first moving device (22, 21, 24, 27, 28, 28a) that has a movable member (22) and moves the table device with respect to the beam irradiating unit by moving the movable member; and a second moving device (24, 27, 29) that moves the table device, wherein the movement of the table device by the second moving device includes a component parallel to the support surface.
Inventors:
ISHIKAWA MOTOFUSA (JP)
Application Number:
PCT/JP2019/026056
Publication Date:
January 07, 2021
Filing Date:
July 01, 2019
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
B22F3/16; B22F3/105; B33Y30/00
Foreign References:
| JP2010228332A | 2010-10-14 | |||
| JP2015196856A | 2015-11-09 | |||
| JP2019007072A | 2019-01-17 | |||
| JP2004122489A | 2004-04-22 | |||
| JP2004042611A | 2004-02-12 |
Attorney, Agent or Firm:
TATEISHI, Atsuji (JP)
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