Title:
MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/157698
Kind Code:
A1
Abstract:
The present invention provides a molding device for molding a heated metal material, the molding device being provided with: a molding die for performing molding so that quenching is performed on a quenching area of the metal material and quenching is not performed on a non-quenching area of the metal material; and a temperature adjustment unit for adjusting the temperature of the molding die so as to reduce warpage in the non-quenching area.
Inventors:
NOGIWA KIMIHIRO (JP)
IDE AKIHIRO (JP)
KAWAKAMI MASASHI (JP)
IDE AKIHIRO (JP)
KAWAKAMI MASASHI (JP)
Application Number:
PCT/JP2023/003845
Publication Date:
August 24, 2023
Filing Date:
February 06, 2023
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D26/033; B21D24/00
Domestic Patent References:
| WO2020195579A1 | 2020-10-01 |
Foreign References:
| JP2015221445A | 2015-12-10 | |||
| JP2019177390A | 2019-10-17 | |||
| JP2009220141A | 2009-10-01 | |||
| JP2000140954A | 2000-05-23 | |||
| JP2009220141A | 2009-10-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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