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Title:
MOLDING DIE, MOLDING DIE MANUFACTURING METHOD, MICROMIXER, MICROMIXER MANUFACTURING METHOD, MICROFLUIDIC CHIP, AND MICROFLUIDIC CHIP MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/017411
Kind Code:
A1
Abstract:
Disclosed is a molding die capable of manufacturing a micromixer that is able to limit the occurrence of liquid residue and the occurrence of flaws and debris associated with mold release. The molding die (114) is a die for molding a micromixer with a perpendicular surface or a microfluidic chip comprising same. The molding die (114) comprises a protrusion (118) for forming the micromixer and the surface roughness of the protrusion (118) is 0.01-5 μm.

Inventors:
GOSHIMA TAKEHIKO (JP)
Application Number:
PCT/JP2015/070055
Publication Date:
February 04, 2016
Filing Date:
July 13, 2015
Export Citation:
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Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B29C33/38; B01F3/08; B01F5/00; B01J19/00; B81B1/00; B81C99/00
Domestic Patent References:
WO2012081072A12012-06-21
Foreign References:
JP2012066417A2012-04-05
JP2005040983A2005-02-17
JP3188770U2014-02-06
JP2010188305A2010-09-02
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Mitsuaki international patent firm (JP)
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